IC Floorplanning and Power Integrity
Posted in Articles, General on August 3rd, 2010 by Raj – Be the first to commentAugust 2010: Early PI-aware design is a significant aspect of IC floorplanning, particularly in nanoscale systems where low power/energy and efficient use of chip/pkg metal and decoupling resources are key design constraints. The advent of 3D integration in the form of chip or package stacking makes early front-end analysis of PI through high levels of abstraction and physics-based simulations all the more necessary. Correlation between PI and thermal issues provides an added benefit in front-end PI analysis and optimization…
Continue reading in an SOCcentral featured article. More on power integrity and floorplanning: Anasim’s PI book for IC’s.
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