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	<title>Anasim &#187; physical design</title>
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	<description>Your Total Power Integrity Team</description>
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		<title>IC Floorplanning and Power Integrity</title>
		<link>http://www.anasim.com/general/ic-floorplanning-and-power-integrity/</link>
		<comments>http://www.anasim.com/general/ic-floorplanning-and-power-integrity/#comments</comments>
		<pubDate>Tue, 03 Aug 2010 20:12:09 +0000</pubDate>
		<dc:creator>Raj</dc:creator>
				<category><![CDATA[Articles]]></category>
		<category><![CDATA[General]]></category>
		<category><![CDATA[3D]]></category>
		<category><![CDATA[Anasim]]></category>
		<category><![CDATA[Floorplanning]]></category>
		<category><![CDATA[front end optimization]]></category>
		<category><![CDATA[front-end]]></category>
		<category><![CDATA[integration]]></category>
		<category><![CDATA[IR Drop]]></category>
		<category><![CDATA[L*di/dt]]></category>
		<category><![CDATA[noise]]></category>
		<category><![CDATA[physical design]]></category>
		<category><![CDATA[power grid]]></category>
		<category><![CDATA[power grid noise]]></category>
		<category><![CDATA[power integrity]]></category>
		<category><![CDATA[SiP]]></category>
		<category><![CDATA[stacking]]></category>
		<category><![CDATA[thermal]]></category>

		<guid isPermaLink="false">http://www.anasim.com/?p=207</guid>
		<description><![CDATA[August 2010: Early PI-aware design is a significant aspect of IC floorplanning, particularly in nanoscale systems where low power/energy and efficient use of chip/pkg metal and decoupling resources are key design constraints. The advent of 3D integration in the form of chip or package stacking makes early front-end analysis of PI through high levels of [...]]]></description>
			<content:encoded><![CDATA[<p><strong>August 2010</strong>: Early PI-aware design is a significant aspect of IC floorplanning, particularly in nanoscale systems where low power/energy and efficient use of chip/pkg metal and decoupling resources are key design constraints. The advent of 3D integration in the form of chip or package stacking makes early front-end analysis of PI through high levels of abstraction and physics-based simulations all the more necessary. Correlation between PI and thermal issues provides an added benefit in front-end PI analysis and optimization&#8230;</p>
<p>Continue reading in an <a href="http://www.soccentral.com/results.asp?CatID=488&amp;EntryID=31901">SOCcentral featured article</a>. More on power integrity and floorplanning: <a href="http://www.amazon.com/dp/0137011229?tag=anasimcorpor-20&amp;camp=14573&amp;creative=327641&amp;linkCode=as1&amp;creativeASIN=0137011229&amp;adid=1BKYXQY9A59ZDYB0CHXZ&amp;">Anasim&#8217;s PI book for IC&#8217;s</a>.</p>
<p>_______________</p>
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		<title>Continuum (Analog) Analysis for Power Integrity</title>
		<link>http://www.anasim.com/articles/continuum-pi/</link>
		<comments>http://www.anasim.com/articles/continuum-pi/#comments</comments>
		<pubDate>Sat, 12 Jun 2010 21:27:35 +0000</pubDate>
		<dc:creator>Raj</dc:creator>
				<category><![CDATA[Articles]]></category>
		<category><![CDATA[Anasim]]></category>
		<category><![CDATA[continuum model]]></category>
		<category><![CDATA[Design Methodology]]></category>
		<category><![CDATA[grid simulation]]></category>
		<category><![CDATA[inductance]]></category>
		<category><![CDATA[IR Drop]]></category>
		<category><![CDATA[L*di/dt]]></category>
		<category><![CDATA[noise]]></category>
		<category><![CDATA[physical design]]></category>
		<category><![CDATA[power]]></category>
		<category><![CDATA[power grid noise]]></category>
		<category><![CDATA[power integrity]]></category>
		<category><![CDATA[simulation]]></category>

		<guid isPermaLink="false">http://www.anasim.com/?p=204</guid>
		<description><![CDATA[June 2010: Power Integrity (PI) analysis has traditionally been conducted using lumped, discrete elements and circuits, which lead to exponential simulation complexity, approximate models, and often, inaccurate results. In continuum-models based analysis, a chip power grid and distribution network is modeled as a continuous surface, employing distributed models for circuits and capacitance. This not only [...]]]></description>
			<content:encoded><![CDATA[<p><strong>June 2010</strong>: Power Integrity (PI) analysis has traditionally been conducted using lumped, discrete elements and circuits, which lead to exponential simulation complexity, approximate models, and often, inaccurate results. In continuum-models based analysis, a chip power grid and distribution network is modeled as a continuous surface, employing distributed models for circuits and capacitance. This not only eliminates the exploding computational complexity for PI analysis in nanoscale chips, it facilitates physical, true-electromagnetic simulations for chips, packages, and 3D assemblies. Continuum-models based analysis is “analog” in the sense that a layer to be analyzed is treated as a spatial potential or voltage continuum, similar to analog signals being time-continuous in nature, as opposed to analyzing discrete elements and their interactions.</p>
<p>Read more on this in a <a href="http://www.soccentral.com/results.asp?EntryID=31446">SOCcentral featured article</a>. A comprehensive treatment of Continuum Modeling is accessible in <a href="http://www.amazon.com/dp/0137011229?tag=anasimcorpor-20&amp;camp=14573&amp;creative=327641&amp;linkCode=as1&amp;creativeASIN=0137011229&amp;adid=1BKYXQY9A59ZDYB0CHXZ&amp;">Anasim&#8217;s PI book for IC&#8217;s</a>.</p>
<p>_______________</p>
]]></content:encoded>
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		<item>
		<title>Roof Planning</title>
		<link>http://www.anasim.com/articles/119/</link>
		<comments>http://www.anasim.com/articles/119/#comments</comments>
		<pubDate>Sat, 16 May 2009 00:18:39 +0000</pubDate>
		<dc:creator>Raj</dc:creator>
				<category><![CDATA[Articles]]></category>
		<category><![CDATA[Floorplanning]]></category>
		<category><![CDATA[grid design]]></category>
		<category><![CDATA[intergity]]></category>
		<category><![CDATA[noise]]></category>
		<category><![CDATA[physical design]]></category>
		<category><![CDATA[power]]></category>
		<category><![CDATA[power grid]]></category>
		<category><![CDATA[power integrity]]></category>
		<category><![CDATA[SoC]]></category>

		<guid isPermaLink="false">http://www.anasim.com/?p=119</guid>
		<description><![CDATA[Power Integrity and Energy Aware Floorplanning: PDF download
&#8220;We have heard so much about floorplanning for integrated circuits &#8211; routing, timing awareness, even leakage and temperature awareness; how often do we come across the term &#8216;Roof Planning&#8217; in SoC&#8217;s?&#8221;
Download the article PDF to read on&#8230;
]]></description>
			<content:encoded><![CDATA[<p><strong>Power Integrity and Energy Aware Floorplanning</strong>: <a href="http://www.anasim.com/papers/pifp1.pdf">PDF download</a></p>
<p>&#8220;We have heard so much about floorplanning for integrated circuits &#8211; routing, timing awareness, even leakage and temperature awareness; how often do we come across the term &#8216;Roof Planning&#8217; in SoC&#8217;s?&#8221;</p>
<p>Download the article PDF to read on&#8230;</p>
]]></content:encoded>
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		<item>
		<title>Anasim Power Integrity Aware Methodology</title>
		<link>http://www.anasim.com/methodology/anasim-power-integrity-aware-methodology/</link>
		<comments>http://www.anasim.com/methodology/anasim-power-integrity-aware-methodology/#comments</comments>
		<pubDate>Sat, 11 Apr 2009 16:33:27 +0000</pubDate>
		<dc:creator>Prathik Raj</dc:creator>
				<category><![CDATA[Methodology]]></category>
		<category><![CDATA[Anasim]]></category>
		<category><![CDATA[Design Methodology]]></category>
		<category><![CDATA[effective current density]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[energy]]></category>
		<category><![CDATA[Floorplanning]]></category>
		<category><![CDATA[front end optimization]]></category>
		<category><![CDATA[grid]]></category>
		<category><![CDATA[grid simulation]]></category>
		<category><![CDATA[IC Design]]></category>
		<category><![CDATA[L*di/dt]]></category>
		<category><![CDATA[layout]]></category>
		<category><![CDATA[noise]]></category>
		<category><![CDATA[physical design]]></category>
		<category><![CDATA[power]]></category>
		<category><![CDATA[power aware]]></category>
		<category><![CDATA[power grid]]></category>
		<category><![CDATA[power integrity]]></category>
		<category><![CDATA[power integrity aware]]></category>
		<category><![CDATA[resonance]]></category>
		<category><![CDATA[simulation]]></category>
		<category><![CDATA[Software]]></category>
		<category><![CDATA[technology]]></category>

		<guid isPermaLink="false">http://www.anasim.com/?p=19</guid>
		<description><![CDATA[A power-integrity-aware physical design methodology enables front-end optimization of power grid metal resource usage, decoupling capacitance planning and placement, and significantly relaxes routing constraints.
Click to enlarge image
]]></description>
			<content:encoded><![CDATA[<p>A power-integrity-aware physical design methodology enables front-end optimization of power grid metal resource usage, decoupling capacitance planning and placement, and significantly relaxes routing constraints.</p>
<div id="attachment_72" class="wp-caption aligncenter" style="width: 610px"><a href="http://www.anasim.com/wp-content/uploads/2009/04/flow2.gif"><img class="size-medium wp-image-72" title="PI-FP Physical Design Methodology" src="http://www.anasim.com/wp-content/uploads/2009/04/flow2-600x571.gif" alt="Power-Integrity (PI) aware ULSI design flow" width="600" height="571" /></a><p class="wp-caption-text">Power-Integrity (PI) aware ULSI design flow</p></div>
<p>Click to enlarge image</p>
]]></content:encoded>
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