Package on Package (PoP) needs multi-grid simulation
Anasim Corporation / Aug. 06, 2008
As handsets and ultra-portable devices continue scaling, a trend that is becoming common is Package-on-Package or PoP. Read more at this EETimes article link.
PoP designs often include multiple chip power grids paralleled together, bringing complex electromagnetic interactions between these grids. Modeling and simulating such multi-grid power integrity scenarios is a snap for pi-fp, and is critical for operating voltage and energy optimization for such system-in-package architectures.
Write Enquiries @Anasim .com for more information.
Tags: active packaging, Grid, multi, multi grid power integrity, Multi grid simulation, multi-grid, package on package, PoP, simulation, SiP, system in package
Differential and Symmetric Power Grid Design
The industry has moved on from the early days of single-ended signaling to differential and symmetric interconnect and achieved 10’s of gigabits of data transmission at low power.
As we now talk about Gigahertz of computational speeds at very low energy, the very same technique and knowledge begins to apply for power delivery and grid design. If signals do better when differential, so will power pathways!
Read a dated but timeless article on Symmetric Power Grid Design by Donald, one of Anasim’s founders.
Contact: donald-at-anasim-dot-com for more information.
Tags: Differential, Grid, power, Symmetry