Package on Package (PoP) needs multi-grid simulation
Anasim Corporation / Aug. 06, 2008
As handsets and ultra-portable devices continue scaling, a trend that is becoming common is Package-on-Package or PoP. Read more at this EETimes article link.
PoP designs often include multiple chip power grids paralleled together, bringing complex electromagnetic interactions between these grids. Modeling and simulating such multi-grid power integrity scenarios is a snap for pi-fp, and is critical for operating voltage and energy optimization for such system-in-package architectures.
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Tags: active packaging, Grid, multi, multi grid power integrity, Multi grid simulation, multi-grid, package on package, PoP, simulation, SiP, system in package